AnandTech

TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have fantastic performance and power efficiency, wafer-scale processors are extremely complex to develop and produce. But TSMC believes that not only will wafer-scale designs ramp up in usage, but that megatr…

While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature and proven process technologies for years to come. Which is why TSMC has continued to refine its existing nodes, including its current-generation 5nm-class offerings. To that end, at its North American Technology Symposium 2024, the company introduc…

Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024 . At a high level, TSMC's 2 nm plans remain largely unchanged : the company is on track to start volume production of chips on it's first-generation GAAFET N2 node in the second half of 2025, and N2P will succeed N2 in late 2026 – albeit…

With the arrival of spring comes showers, flowers, and in the technology industry, TSMC's annual technology symposium series. With customers spread all around the world, the Taiwanese pure play foundry has adopted an interesting strategy for updating its customers on its fab plans, holding a series of symposiums from Silicon Valley to Shanghai. Kicking off the series every year – and giving us ou…

Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move by Western Digital, which increased its prices earlier this month. These changes come in response to a surge in demand for high-capacity HDDs and constraints in supply due to decreased production capabilities of bot…

As Qualcomm prepares for the mid-year launch of their forthcoming Snapdragon X SoCs for PCs, and the eagerly anticipated Oryon CPU cores within, the company is finally shoring up their official product plans, and releasing some additional technical details in the process. Thus far the company has been demonstrating their Snapdragon X Elite SoC in its highest-performing, fully-enabled configuratio…

As Seagate ramps up shipments of its new heat assisted magnetic recording (HAMR)-based Mozaic 3+ hard drive platform , the company is both in the enviable position of shipping the first major new hard drive technology in a decade, and the much less enviable position of proving the reliability of the first major new hard drive technology in a decade. Due to HAMR's use of temporal heating with its …

Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using a triple-level cell (TLC) architecture, with data transfer rates as high as 3.2 GT/s. The new 3D TLC NAND memory will initially be used to build high-capacity and high-performance SSDs, which will help to solidify Samsung's position i…

Lexar has a long history of serving the flash-based consumer storage market in the form of SSDs, memory cards, and USB flash drives. After having started out as a Micron brand, the company was acquired by Longsys which has diversified its product lineup with regular introduction of new products. Recently, the company announced a number of portable SSDs targeting different market segments. The Lex…

While desktop PC power supplies receive the bulk of enthusiasts’ attention for good reasons – not the least of which being the vast selection of options that comes from being a standardized part – power supplies as a whole aren’t just a concern for big PCs. With the majority of PC sales having flipped to notebook sales some years ago, notebook power supplies already lead the market in volume. And…

When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s , while leaving the spec open to further expansions with faster memory as technology progressed. Now, a bit more than three-and-a-half years later, and the standards body and its members are gearing up to release a faster generati…

SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hy…

AMD is looking to drive the AI PC market with options across multiple product lines, which aren't limited to consumer processors. While primarily designed for the commercial sector, AMD has announced the Ryzen Pro 8000 'Phoenix' series of APUs for desktops, which AMD claims is the first professional-grade CPU to include an NPU designed to provide on-chip AI neural processing capabilities. AMD has…

Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for the quarter, which is up 12.9% year-over-year, but a decline of 3.8% quarter-over-quarter . The company says that in increase in demand for HPC processors (which includes processors for AI, PCs, and servers) dr…

This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype system at its fab in Veldhoven, the Netherlands, has printed the first 10nm patterns, which is a major milestone for ASML and their next-gen tools. Second, the company has also revealed that i…