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FitTech to begin shipping edge-emitting laser probing/testing equipment in 4Q20

LED probing, testing and sorting equipment maker FiTech has newly developed equipment for probing and testing edge-emitting laser diodes and expects shipments to begin in the fourth quarter of 2020, according to company chairman Chiu-tien Hsu.

TSMC EUV litho equipment purchases to top 50 sets

TSMC is expected to cumulatively purchase about 55 sets of EUV lithography equipment by the end of 2021, as the foundry is stepping up its EUV process manufacturing development, according to industry sources.

CHPT gearing up smart production of vertical probe cards

Taiwan-based IC test interface specialist Chunghwa Precision Test Technology (CHPT) is stepping up AI-based smart production of vertical probe cards (VPC) seeking to compete well with the world's top suppliers in the segment in the US and Europe, according to company president Scott Huang.

Power inductor maker Arlitech sees strong demand ahead

Taiwan-based power inductor supplier Arlitech Electronic expects its sales to grow steadily in the second half of 2020 thanks to robust demand for power conductors from the LCD industry, according to industry sources.

Ledtech set to ship low-temperature UV-C LED light tubes

LED lighting module maker Ledtech Electronics has partnered with Taiwan- and China-based LED chip makers to develop low-temperature UV(ultraviolet)-C LED light tubes used in commercial refrigerators with the products in process of certification by its Latin America-based clients. Shipments are likely to begin in the second quarter of 2021, according to company chairman and CEO Shou-hsiung Liu.

Globalfoundries announces new 22FDX+ platform

Globalfoundries has announced the next generation of its FDX platform, 22FDX+, designed to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices.

Merck to expand investments in Taiwan

Merck has announced a plan to expand investments in Taiwan, seeking to turn its plant in Kaohsiung, southern Taiwan into a new R&D hub for deposition materials.

Highlights of the day: TSMC 3nm monthly output to reach 100,000 wafers

Demand for TSMC's advanced process support has been strong. The foundry is set to move the 3nm node to volume production in 2022, with monthly output expected to reach 100,000 wafers in 2023. It remains to be seen whether Huawei - banished by the US from large parts of the IT world - could receive capacity support from TSMC again. Handset retailers in China are raising prices for Huawei smartph...

Foxconn, Adlink set up AMR joint venture

Foxconn Electronics (Hon Hai Precision Industry) and industrial computing device maker Adlink Technology on September 24 inaugurated FARobot, their joint venture for developing autonomous mobile robot (AMR) solutions.

Samsung launches Galaxy S20 FE 5G in Taiwan

Samsung Electronics has launched its Galaxy S20 FE 5G, a lite version of its Galaxy S20, in the Taiwan market for NT$23,990 (US$820) with delivery to kick off on October 7.

Kingston intros 16Gb DRAM for servers

Kingston Technology's Server Premier product line has been upgraded to feature 16Gb solutions, according to the memory module vendor.

Taiwan supply chain sees robust China demand for IC design services for ASICs

Taiwan's IC design services providers has seen orders ramp up significantly so far this year from Chinese clients who are eager to develop ASICs, according to industry sources.

ACSI expects rising demand for cyber security solutions

Taiwan-based IT security specialist Acer Cyber Security (ACSI), a subsidiary of the Acer Group, is optimistic about its operation in 2020 and 2021 as enterprises worldwide have been accelerating digital transformation in the wake of the coronavirus outbreak, according to company president Rex Wu.

Taiwan to invest NT$50 billion in 5G infrastructure in 2021-2025

Taiwan's government will invest up to NT$50 billion (US$ 1.709 billion) in 5G infrastructure construction in the next five years, according to vice president William Lai.

BOE to acquire majority stakes in CEC-Panda LCD fabs

BOE Technology has reached a deal to acquire majority stakes in two advanced LCD fabs owned by CEC-Panda LCD Technology in Nanjing and Chengdu respectively for a total of CNY12.117 billion (US$1.78 billion) , making it the largest ever acquisition in China's display industry.
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