Wi-Fi 7 will spark demand for QFN packaging, burn-in testing

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Friday 21 January 2022 0

Credit: DIGITIMES

With chip vendors (including Broadcom, Intel, MediaTek, and Qualcomm) gearing up for the development of Wi-Fi 7 chip solutions, QFN packaging and burn-in testing demand will be ramping up, according to industry sources.

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